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The test is intended to accelerate the corrosion while simulating conditions that may be found within process equipment and gas systems in the semiconductor industry
The identification of these quality parameters is intended to help equipment users and suppliers specify and utilize capabilities for process control
Failure mechanisms
or other laser-based light scattering detection schemes)
This Document defines three orthogonal reference planes as references for carrier dimensions
MF145100 - SEMI MF1451 - Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning Revision:SEMI MF1451-0707 (Reapproved 0421) - Current The test is intended toSori can significantly affect the yield of semiconductor device processing. Knowledge of this characteristic can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements. Changes in wafer sori during processing can adversely affect subsequent handling and processing steps. These changes can also provide an important process monitoring function. This Test Method is suitable
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US$ 2249.25
