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and the surface elemental compositions by electron spectroscopy for chemical analysis (ESCA)
setting test patterns
25 mm/182 mm ± 0
SEMI C18-0714 (Reapproved 0620)
Figure 3은 이 문서에서 명시된 병렬 I/O 인터페이스에 대한 어플리케이션을 설명한다
G02600 - SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids StdTpc-300 mm Carriers & Physical Interfaces and the surface elemental compositionsThis specification covers the ceramic piece part commonly referred to as a lid, used in the construction of a hermetic SLAM package with a 0. 050" pad centerline. The SLAM package is covered separately in SEMI G5. Referenced SEMI Standards None.
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