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이 표준의 목적은 캐리어(carrier) 전송의 신뢰성과 효율성 개선을 위해 SEMI E23에서 정의된 병렬 I/O 인터페이스의 기능을 강화하는 것이다
org發行線上版本。本基準原始版本於1998年發行，2009年3月再版。
This Standard describes procedures for measuring the mechanical
blow molding
For measurement
G07200 - SEMI G72 - ボールグリッドアレイ設計ライブラリのための仕様 StdPbc-0323 이 표준의 목적은 캐리어(carrier) 전송의global Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org19979 : BGA Subordinate Documents: SEMI G72. 1 0997 Design Proposal for Ball Grid Array Design Library: 292 Pin Plastic Ball Grid Array SEMI G72. 2 0997 Design Proposal for Ball Grid Array Design Library: 388 Pin Plastic Ball Grid Array Referenced SEMI Standards None.
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