G08800 - SEMI G88 - Specification for Tape Frame for 450 mm Wafer Revision:SEMI G88-0211 - Superseded and a thickness of 700

and a thickness of 700 µm

The scope of this Document is all grades of tetraethylorthosilicate used in the semiconductor industry

This Document covers requirements for hexafluoroethane used in the semiconductor industry

10 — Specification for Sensor/Actuator Network Specific Device Model for an In Situ Particle Monitor Device

SEMI G87-1108 (Reapproved 0215)

G08800 - SEMI G88 - Specification for Tape Frame for 450 mm Wafer Revision:SEMI G88-0211 - Superseded and a thickness of 700The purpose of this Document is to standardize the specifications for 450 mm wafer tape frames used between the dicing process and the die bonding process, and also used for shipping and handling. This Standard is applicable to 450 mm wafer tape frames. This Standard documents the dimensions, characteristics, and measurement methods for 450 mm wafer tape frames. This Standard can be used as the specification sheet for tape frame upon purchasing.