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SEMI 3D12-1020 (technical revision)
This Guide defines standardized positions for measuring diameter of circular wafers of silicon and other semiconducting materials especially those processed with edge-follower edge-rounding equipment that contain flats or notches (fiducials) on the periphery
Determination of material performance in actual device fabrication situations is beyond the scope of these methods
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SEMI E22-1015 (technical revision)
G02500 - SEMI G25 - Test Method for Measuring the Resistance of Package Leads Revision:SEMI G25-89 - Superseded SEMI 3D12-1020 (technical revision)This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 1, 2011. Available at www. semiviews. org and www. semi. org in August 2011; originally published in 1984; previously published in 1989. This Document defines the equipment, materials, and procedure used to measure the resistance of leads in packaging elements.
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