3D01700 - SEMI 3D17 - Specification for Reference Material for Bonded Wafer Stack Void Metrology StdPbc-0624 The purpose of this Standard

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3D01700 - SEMI 3D17 - Specification for Reference Material for Bonded Wafer Stack Void Metrology StdPbc-0624 The purpose of this StandardThis Specification describes requisite test structures, including design, manufacturing, and certification procedure for a bonded wafer reference sample composed of two wafers. Referenced SEMI Standards (purchase separately) SEMI 3D13 Guide for Measuring Voids in Bonded Wafer Stacks SEMI M20 Practice for Establishing a Wafer Coordinate System Revision History SEMI 3D17 1123 (technical revision) SEMI 3D17 1217 (first published)