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Charged wafer and reticle surfaces attract airborne particles (electrostatic attraction [ESA]) and increase the defect rate
SEMI 3D11-1214 (Reapproved 1125)
Only mixed virgin HPIX resin is used for the testing within this Guide
SEMI E159 — Specification for Mechanical Features of Multi Application Carrier (MAC) Used to Transport and Ship 450 mm Wafers
The purpose of this Document is to standardize requirements for trimethylphosphite used in the semiconductor industry and testing procedures to support those standards
F06200 - SEMI F62 - Test Method for Determining Mass Flow Controller Performance Characteristics for Ambient and Gas Temperature Effects StdPbc-0619 Charged wafer and reticle surfacesThis Standard defines a method for testing mass flow controllers (MFCs) being considered for installation into a gas distribution system and to quantify ambient and gas temperature effects on the MFCs indicated and actual flow. This Test Method applies to metal and polymer sealed MFCs. The tests include those listed below and are to be performed in the following order: 1. Ambient Temperature Effects (Steady State and Transient) 2. Gas Temperature
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